Electroless UBM Formation Service｜Special Site of JX Metals

Introduction to application examples, advantages, and standard specifications of electroless UBM formation service

Copper Foil - JX Metals

総合めっき薬品会社｜メルテックス株式会社

Electroless Palladium Processes

Simulation of current distribution in the solder bump: ͑ a ͒ Solder

Sn-Cu-PET foil for electromagnetic shielding - JX Metals

UBM (Under Bump Metallization)

Electroless UBM and solder bump [12, 17]

Figure 1 from Effect of Under Bump Metallization (UBM) Quality on Long Term Reliability

The reliability of lead-free solder joint subjected to special environment: a review

Compound Semiconductors and Crystal Materials - JX Metals

The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition - ScienceDirect

The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition - ScienceDirect

Electronic Materials of JX Nippon Mining & Metals

The reliability of lead-free solder joint subjected to special environment: a review