Liner Sweep Voltammetry Electroplating Method to Synthesize Large Monocrystalline Cu Cones for Interconnection

2D Materials in Flexible Electronics: Recent Advances and Future Prospectives

Frontiers of Cu Electrodeposition and Electroless Plating for On-chip Interconnects

A review of helical nanostructures: Growth theories, synthesis strategies and properties

Huiqin LING, Shanghai Jiao Tong University, Shanghai, SJTU, State Key Laboratory of Metal Matrix Composites

Materials-Driven Soft Wearable Bioelectronics for Connected Healthcare

A review of helical nanostructures: Growth theories, synthesis strategies and properties

Hollow CoP Encapsulated in an N-Doped Carbon Nanocage as an Efficient Bifunctional Electrocatalyst for Overall Water Splitting

Cyclic voltammetry at 50 mV/s of iron plating/stripping in chloride and

吴蕴雯- 上海交通大学材料科学与工程学院

Structural Accelerating Effect of Chloride on Copper Electrodeposition

Enhanced electromigration resistance through grain size modulation in copper interconnects